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  • Hong Kong, China Signs Memoranda of Understanding with Cambodia and Malaysia
  • WIPO Launches the WIPO Mediation Pledge by SEP Holders to IoT SMEs
  • World Intellectual Property Indicators Report: Global Patent and Design Filings Reach New Records in 2024, Trademarks Flat
  • The Decision of the China National Intellectual Property Administration (CNIPA) on Amending the Guidelines for Patent Examination (Decree No. 84)
  • China-Brazil PPH Pilot Program Extended to 2029
  • User Guide of IP5 Trial and Appeal Procedures Released for the First Time
  • WIPO: New E-mail Requirement for Madrid System Users (Effective November 2025)
  • Taiwan, China Proceeds with the Trial of the Accelerated Examination Program for Reexamination (AEPRe)
  • Hong Kong, China Updated Forms of Patents and Designs from October 1, 2025
  • Global Innovation Index 2025 was Released and China made Global Top 10 for the First Time
  • Hong Kong and the WIPO Signed a Memorandum of Understanding on Database
  • The 2024 Annual Report of the CNIPA Is Released
  • China Steadily Maintains Its First Ranking in the World by the Number of Global Top 100 Innovation Clusters, and the Shenzhen-Hong Kong-Guangzhou Cluster Hits the Top of the World
  • 2025 WIPO Global Awards Announced: Chinese Enterprises Make the List for Four Consecutive Years
  • China National Intellectual Property Administration (CNIPA) Trademark Office Notice on the Revision of Certain Application Forms
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